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BGA Heat Sink

What is a BGA Heatsink

A BGA (Ball Grid Array) heatsink is a compact thermal solution specifically for BGA-packaged components, which are widely used in high-density, high-performance electronics such as CPUs, GPUs, chipsets, and FPGAs.

These heatsinks are designed to fit tight spaces and efficiently transfer heat away from the chip surface. By maintaining optimal operating temperatures, BGA heatsinks help ensure system reliability, prevent thermal throttling, and prolong component lifespan.

Materials & Surface Finishes

For BGA heat sinks, selecting the right material and surface finish is essential to achieve efficient thermal management, reliable component protection, and long-term stability in compact electronic designs.

Common Materials

Aluminum alloy, particularly AL6063, serves as the preferred choice for BGA heat sinks due to its excellent thermal conductivity.

Surface Finishes

Black anodizing is often used to enhance corrosion resistance and improve emissivity for enhancing heat dissipation through radiation. Powder coating or other surface finishes may also be used to improve appearance and provide additional protection in demanding environments.

Features of BGA Heat Sinks

Compact Footprint

BGA heat sinks feature a small form factor to match the limited surface area of BGA packages. Thanks to this design, they can provide efficient heat dissipation without interfering with adjacent components on densely populated PCBs.

Easy Installation Options

Many BGA heat sinks support pre-applied thermal adhesive or thermal pads, simplifying the installation process and eliminating the need for mechanical fasteners. By doing so, these units not only reduce assembly time but also ensure consistent thermal contact.

High Volume Manufacturing

BGA heat sinks are well-suited for mass production and standardized applications, offering reliable thermal performance at scale. With various designs and material selection, they are optimized for automated assembly lines, making them ideal for consumer electronics, networking devices, and industrial systems.

Why Choose Dingmetal

  • Proven Expertise

With over a decade of experience in BGA heatsink manufacturing, Dingmetal delivers reliable thermal solutions aligned with industry standards and evolving application needs.

  • Highly Customizable Options

With over 90% of our products being custom-made, we take pride in our ability to provide tailored solutions for specific requirements. Thanks to our superior manufacturing capabilities, we can produce highly customized heat sinks that match your exact needs, whether adjusting the design, material, or size.

  • Reliable Stock Availability

We maintain a well-managed inventory of standard BGA heatsinks to ensure a consistent supply and fast delivery for small and large production runs, helping you avoid lead time issues.

Applications of BGA Heat Sink

BGA heat sinks are widely used in electronic devices and systems to manage the heat generated by high-density ball grid array packages. They are commonly applied in computers, servers, communication equipment, and consumer electronics.

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  • Dingmetal Industry Co., Ltd.
  • +86 13691922471
  • sales1@dingmetal.com
  • No.11, Kui Qing Road, Qingxi Town, Dongguan City, Guangdong Province, China
  • Vietnam km70 . Highway 5A, Phuong Due village, Kim Xuyen commune, Kim Thanh district, Hai Duong province. Vietnam 03308 km70 . quốc lộ 5A thôn Phương Duệ.xã kim xuyên.huyện kim thành.tỉnh hải dương. việt nam 03308

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